Here we display our good quality and advance pulse power supply to you.

Pulse power supply gold plating

Pulse power supply gold plating superiority:

The superiority of pulse power supply plating can be better reflected especially on gold plating. Pulse power supply gold plating could obtain dense crystal electroplating layer coating, that not only significantly increased its finish degree, corrosion resistance, weldability, wear resistance, high temperature capability and have a greater degree of discoloration, but also greatly saved gold.

Pulse power supply gold plating

Pulse power supply gold plating

Someone think no need pulse power supply gold plating:

But there is a view: that barrel gold electro plating using pulse power supply of little significance to improve the density, which their reason is that the barrel plating machine tumbling action make the coarse crystals can not grow, therefore can get dense electroplating layer coating, bright, so no need use a pulse power supply. This view seems not unreasonable, but that is biased. Because barrel plating machine tumbling just a mechanical polishing action, its limited capacity and can not replace the role of fine-grained action generated large pulse current by electro chemical polarization. Therefore, if there is high quality requirements of gold plating, still need to use pulse rectifier gold plating, which this is the best control method outside the plating tank.

Vivid explain to tell you why need pulse power supply gold plating:

For example, now integrated lead frame, linear tube shell, connectors and other parts the pulse power supply barrel plating has been very common.
Also, there is gradually formed a consensus that gold plating bottom plating – nickel layer electroplating should also adopts pulse rectifier plating. The reason is pulse-plated nickel layer of stress, density, uniformity is far superior to the DC rectifier nickel plating, which undoubtedly will lay a solid foundation for gold electro plating, thus greatly improving the functional indicators of gold plating.
For example, one electronic products factory choosing pulse rectifier plating for products gold plating, and the thickness of the gold electro plating layer meet the requirements, which plating workpieces appearance is also good, but still can not meet the 380 ℃ ~ 450 ℃ temperature assessment test. Then they hire experts to help them to solve the problem. One of the measures is to use a pulse power supply nickel barrel plating instead of DC power supply, of course, there are other measures, such as strict operation, improved Pulse power supply gold plating liquid formulations and so on.

The parameters pulse power supply gold plating adopt can refer to the following:

Single pulse: 10% to 20% duty cycle (turn on: 0.1ms ~ 0.2ms, turn off: 0.8ms ~ 0.9ms), pulse frequency 900Hz ~ 1000Hz, the average current density equal to or slightly larger than the DC power source plating;
Reverse pulse: positive pulse duty cycle of 20% (turn on: 0.2ms, turn off: 0.8ms), working time 100ms, the average current density equal to or slightly larger than the DC rectifier plating;
Reverse pulse duty cycle of 10% (on 0.1 ms, off 0.9ms), working time 10ms, an average current density of the reverse peak current density of the positive peak current density of 1 to 2 times, obtained by calculating backwards.

But many people believe that when acidic gold plating, because the gold anode insolubility, reverse peeling double pulse does not work, so the use of the double pulse is superfluous. In fact, the double pulse reverse reeling gold plating only improve the uniformity small, but it can not say that is superfluous, or can not say there is no significance. There is a small experiment may indicate the presence or absence of other dual pulse gilded significance. In the same acidic gold plating solution, the same current density, respectively, DC power source, single pulse, double pulse at the same time each plating a test piece. Comparison of three test pieces, can see clearly that the plating coating brightness is incrementally from DC to single pulse and then to double pulse power supply gold plating.

This shows dual pulse reverse stripping gold plating for improving the crystallization is advantageous, otherwise adopting double pulse plating will not more bright than the single pulse. This should be due to that though reverse pulse not achieve anodic dissolution, but can play the role of electro-polishing, which facilitates the subsequent cathodic deposition coating pulse period is more detailed, bright.

Further, reverse pulse may also have the plating coating be more fully in the subsequent recrystallization cathode pulse period effect, and thus the plating layer coating will be finer grain.

But the reverse pulse work time shall not too long (less than 1/10 of the positive pulse time), otherwise the deposition rate is slow. Also, reverse pulse peak current density should not be less than the positive pulse, otherwise reverse electro-polishing effect is not obvious. Double pulse barre plating as well. Decorative gold plating barrel plating time is short, thin plating coating, good brightness Ni underlying coating nonfunctional requirements, so generally not suggest the use of pulse power supply plating, in order to save the cost of expensive pulse rectifier. But production practice shows that, use double pulse power supply gold plating, if select parameter properly, plating time can be shortened more than 1/3, so as to achieve the effect of the save gold.

Pulse power supply

Pulse power supply Overview:

Pulse power supply plating is a powerful means of external bath for metal electrodeposition. It uses the time function to improve the physical and chemical properties of plating coating by changing the pulse parameters, therefore to achieve saving of precious metals and obtain a functional electroplating layer coating purposes. Pulse reverse power supply belonging to a modulation current pulse electro plating, the current it uses is a fluctuation or continuity DC impulse current, so pulse reverse power supply plating is essentially an on-off DC plating.

Pulse power supply waveform type:

There are a variety of Pulse reverse power supply current waveform, the common are square-wave, triangle, ramp, ladder wave. However, the current application, typical pulse reverse power supply generating square wave pulse current is widely used. Thus, the study of pulse plating are generally carried out around the square wave form.

Pulse power supply waveform

Pulse power supply waveform

Modulation current power supply plating:

Traditional electro plating is generally as direct current, referred to as DC. DC current is a current direction does not change with time, there is only parameter can be set–current or voltage. DC current waveform common as single-phase half-wave, single-phase full-wave, three-phase half-wave, three-phase full-wave DC or steady current, etc., commonly to generate these waveforms plating power supply have: silicon rectifier, thyristor rectifier, high-frequency switching power supplies etc..

Disadvantage of DC rectifier compare with pulse power supply:

Not difficult to see, DC with feature of current continuity or duration, not interrupted or changed over time, thus the use of only one parameter – current or voltage to be adjusted. This makes the DC current as a means outside bath control plating quality lack of strength. For example, the DC current are useless in cathode current density increase, inhibit side reactions, and reduce the content of impurities in electroplating, as well as to improve current distribution, etc.

After alternating with pulse signal other signal modulation DC current called as modulation current, modulated current used for plating is called modulated current plating. Modulated current plating existed as mainly used for outer plating tank quality control, it can often play the role that DC rectifier plating can not achieve quality. For example, pulse power supply plating increase several times or even ten times than DC plating cathodic current density, and get detailed crystal plating coating. Modulation current pulse plating generally has: pulse plating, asymmetric exchange plating, DC superimposed plating cycle pulse reverse electroplating.

Pulse reverse power supply

Pulse reverse power supply

Hard oxidation

Hard oxidation and ordinary oxidation difference: Hard anodized oxide film has 50% penetration inside the aluminum products, an another 50% attached to the aluminum workpieces surface, so after a hard anodizing exterior of the product size becomes bigger, the hole becomes smaller, while after hard oxidation the external dimensions of ordinary oxidation becomes smaller and the hole becomes bigger.

Hard oxidation colors:

Hard oxidation colors usually made of black and oxidation film true colour (natural color), true color is determined by the aluminum alloy composition, even the same type of aluminum ( for example 6061-T6), and different manufacturers, the color of the oxide film is different, if Aluminum use same manufacturer the same type of material maybe colors are different, and therefore, the true nature of the oxide film is generally used for the internal parts of the product.

Hard oxidation aluminum advantages:

1, Aluminum hard anodizing surface hardness can even up to HV500, which can compare to chrome plating;
2, The hard anodizing film thickness from 25 to 250um;
3, Have features of strong adhesion, according to the generated hard anodized oxidation characteristics: hard oxidation film has a 50% penetration in aluminum inside,
50% adhered to the surface of an aluminum alloy;
4, Good insulation: breakdown voltage up to 2000V;
5, Great wear resistance: for if copper content more than 2% in aluminum alloy, its maximum wear index of 3.5mg/1000rpm. All other alloys wear index should not exceed than 1.5mg/1000rpm;
6, Non-toxic: the oxidation film and for anodic oxide film produced by an electrochemical process there is no toxic to humans.

So now a lot of industry in order to facilitate machining and reduce the weight of products, and environmental protection requirements, some hard oxidation aluminum alloy parts products are currently to replace stainless steel, and conventional spray, plating treatment process.

Hard oxidation real case:

This customer use our Hard oxidation pulse power supply for aluminum pot hard oxidation, the result is very good. You can see the below surface, the hardness also very good, there is no any scratch on surface even use a knife to cut the aluminum pot hard anodizing surface.

2000A90V Hard oxidation rectifier, using our power supply you can get very good treatment even 2 & 7 series aluminum grade.

Oxidation pulse power supply

Oxidation pulse power supply

Hard oxidation pot using our pulse rectifier

Hard oxidation pot using our pulse rectifier

Hard oxidation pot using our pulse power supply

Hard oxidation pot using our pulse power supply

Single pulse plating power supply

Single pulse plating power supply

Single pulse plating power supplySingle pulse plating power supply technical parameters and specifications:

Output waveformSquare wave/Direct current
Frequency (Hz)5-50005-50005-50005-50005-50005-50005-50005-5000
Duty cycle (%)0-1000-1000-1000-1000-1000-1000-1000-100
Output current

Oxidation pulse power supply

Oxidation pulse power supply:

If in oxidation treatment processes, you have high requirements: which is including film thickness, hardness, acid corrosion and film breakdown voltage requirements of high production requirements, please choose this special oxidation pulse power supply.

This is real oxidation pulse power supply, from the customers testing come to the conclusion: compare with general type rectifiers, our oxidation pulse power supply can we improve the quality of oxide film about 3 times, with features of output pulse, DC superimposed, pulse pole switching, DC and so on.